Comprehensive Performance Advantages：

•  Reliable in High-Temperature Environments
  —— Ensures long-term adhesion without peeling under extreme conditions such as welding, motor insulation, and heating element wrapping.
•  Ultra-Thin, High-Strength Lamination
  —— Available in thicknesses as low as 12.5 μm — highly flexible and ideal for micro-electronic applications like mobile phone FPC shielding.
•  Flexible Surface Treatment Options
  —— Single or double-sided application available. Can be laminated with conductive materials (e.g., copper foil), release films, or high-temperature release paper.
•  Environmentally Safe & Compliant
  —— Halogen-free, non-silicon migrating, and fully compliant with RoHS and REACH standards. Safe for indirect contact with medical and food-grade equipment.
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Product Specifications：

•  Substrate: polyimide film (PI)
•  Color Options: amber, black
•  Adhesive System: organic pressure-sensitive silicone
•  Adhesion Strength: 80 – 900 g
•  Thickness Range: 0.05mm-0.2mm
•  Max Width: up to 1020mm
•  Special process: antistatic liquid on the surface of the substrate

If you need technical information, samples, or customization support, please feel free to contact us.