Pushing the Limits: Why Polyimide Film Is the Core Material for High-Temperature Electronics & Aerospace Applications
Why It Leads the Industry
- Extreme Heat Resistance: Withstands temperatures up to 400 °C
- Exceptional Electrical Insulation: Reliable performance in harsh electrical environments
- Dimensional Stability: Maintains precision and structure under thermal and mechanical stress
Key Applications
- Flexible Printed Circuit (FPC) Substrate
- Essential in foldable smartphone hinges and wearable device wiring
- Enables lightweight, three-dimensional circuit layouts — replacing traditional rigid PCBs
- High-Temperature Motor Insulation
- Provides insulation for EV drive motors and wind turbine windings
- Enhances performance and durability in energy-critical systems
- Advanced Packaging Material
- Serves as a solar panel substrate on spacecraft, shielding from cosmic radiation
- Used as a protective film for sensors in nuclear power plants and other extreme environments
- Crucial Process Consumables
- Acts as a carrier film for semiconductor wafer laser cutting
- Functions as a release film in lithium battery hot pressing and lamination processes
Solving Industry Pain Points
- Replaces brittle traditional materials in high-temperature applications
- Minimizes thermal expansion-induced errors in precision equipment
- Offers an environmentally friendly alternative to fluorinated materials, helping meet RoHS/REACH compliance
